@tubetime would it have made sense to have a fab produce that, or is that something that's a common by-product/dummy run/defective packages that happens often in chip fabs, and they just labelled it? do you think there's a chance it's rejected completely unrelated defective chips just relabeled?

@mavica_again could have been defective chips but the packaging house runs empty packages all the time for testing purposes, no fab needed

@tubetime ahh, i wasn't sure which part happened were, was just using "fab" as a catch-all term for the end product being manufactured, thanks for the insight!

@mavica_again @tubetime as I recall the packages kinda varied. Some looked like they were properly labelled, others looked like they were sanded down and laser etched or something. My guess would be the properly labelled ones were empty packages and the sanded looking ones were floor sweepings of random chips.

@mavica_again @tubetime As I recall it really wouldn't matter what was in those spaces, as they were not even wired to anything but each other in some convincing looking top-layer interconnects.